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Soft lead-free electronic solder no. 1 RoHS-compliant
- Weight of content: 250 g
- Material designation: S-Sn99.3Cu0.7
- EN standard: 29454-1
- Cu composition of the brazing solder (weight-%): 0.7 %
- ISO: 9453
- Sn composition of the brazing solder (weight-%): 99.3 %
- Min./max. processing temperature: 350 to 450 °C
- Min. processing temperature: 350 °C
- Max. processing temperature: 450 °C
- Min. melting temperature: 227 °C
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- RoHS-compliant
- S-Sn99,3Cu0,7 in accordance with DIN EN ISO 9453
- Fluxing composition in accordance with DIN EN 29454.1, 1.1.2.B with organic, halogen-free activation additives
- Processing temperature: 350-450°C
- Melting range: 227°C
Circuit boards, electrical engineering
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